• DocumentCode
    3447313
  • Title

    Some applications of V/sub BD/ and Q/sub BD/ tests

  • Author

    Chen, J.T.C. ; Dimitrova, T. ; Dimitrov, D. ; Park, K. ; Schroder, D.K.

  • Author_Institution
    Four Dimensions, Inc., Hayward, CA
  • fYear
    2005
  • fDate
    17-20 Oct. 2005
  • Abstract
    Much work has been done and many papers have been published on gate oxide integrity. The work is largely concentrated on characterization, modeling of oxide degradation and breakdown under stress and measurement techniques. With such extended knowledge and techniques on oxide reliability available, we can make use of that for monitoring wafer quality and process equipment. Here we show that VBD measurements reflect different aspect of oxide characteristics from QBD measurements and each can be used for its corresponding monitoring applications
  • Keywords
    integrated circuit measurement; integrated circuit modelling; integrated circuit reliability; integrated circuit testing; gate oxide integrity; oxide breakdown; oxide characteristics; oxide degradation; oxide reliability; process equipment; wafer quality; Area measurement; Breakdown voltage; Conductivity; Current measurement; Density measurement; Design for quality; Monitoring; Stress; Surface cleaning; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop Final Report, 2005 IEEE International
  • Conference_Location
    S. Lake Tahoe, CA
  • Print_ISBN
    0-7803-8992-1
  • Type

    conf

  • DOI
    10.1109/IRWS.2005.1609582
  • Filename
    1609582