DocumentCode :
3447313
Title :
Some applications of V/sub BD/ and Q/sub BD/ tests
Author :
Chen, J.T.C. ; Dimitrova, T. ; Dimitrov, D. ; Park, K. ; Schroder, D.K.
Author_Institution :
Four Dimensions, Inc., Hayward, CA
fYear :
2005
fDate :
17-20 Oct. 2005
Abstract :
Much work has been done and many papers have been published on gate oxide integrity. The work is largely concentrated on characterization, modeling of oxide degradation and breakdown under stress and measurement techniques. With such extended knowledge and techniques on oxide reliability available, we can make use of that for monitoring wafer quality and process equipment. Here we show that VBD measurements reflect different aspect of oxide characteristics from QBD measurements and each can be used for its corresponding monitoring applications
Keywords :
integrated circuit measurement; integrated circuit modelling; integrated circuit reliability; integrated circuit testing; gate oxide integrity; oxide breakdown; oxide characteristics; oxide degradation; oxide reliability; process equipment; wafer quality; Area measurement; Breakdown voltage; Conductivity; Current measurement; Density measurement; Design for quality; Monitoring; Stress; Surface cleaning; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Reliability Workshop Final Report, 2005 IEEE International
Conference_Location :
S. Lake Tahoe, CA
Print_ISBN :
0-7803-8992-1
Type :
conf
DOI :
10.1109/IRWS.2005.1609582
Filename :
1609582
Link To Document :
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