Title :
Resistivity of nanometer-scale films and interconnects: model and simulation
Author :
Yarimbiyik, A. Emre ; Schafft, Harry A. ; Allen, Richard A. ; Zaghloul, Mona E. ; Blackburn, David L.
Author_Institution :
Dept. of Electr. & Comput. Eng., George Washington Univ., DC, USA
Abstract :
We have developed a highly versatile simulation program for examining the impact of reduced dimensions on resistivity that goes beyond the work of others, e.g. Fuchs and Mayadas and Shatzkes. The program can simulate the effects of surface and grain-boundary scattering on the resistivity of thin films and lines, either separately or simultaneously. It is used to understand the importance of grain size and how surface and grain boundary scattering impacts the effective resistivity. It predicts how Matthiessen´s rule will change with decreasing dimensions, which impacts the ability to determine accurately film thickness and line area from resistance measurements taken at two temperatures.
Keywords :
electric resistance measurement; electrical resistivity; grain boundaries; integrated circuit interconnections; integrated circuit modelling; nanoelectronics; thin films; Matthiessen rule; grain size; grain-boundary scattering; nanometer-scale film resistivity; nanometer-scale interconnects; resistance measurements; surface scattering; thin film resistivity; Computational modeling; Conductivity; Copper; Electrons; Grain boundaries; Grain size; Particle scattering; Predictive models; Scattering parameters; Semiconductor films;
Conference_Titel :
Integrated Reliability Workshop Final Report, 2005 IEEE International
Print_ISBN :
0-7803-8992-1
DOI :
10.1109/IRWS.2005.1609585