Title : 
Recovery behavior in amorphous silicon solar module at low temperature
         
        
            Author : 
Hsieh, Hsin-Hsin ; Cheng, Jung-Sheng
         
        
            Author_Institution : 
Photovoltaics Technol. Center Ind. Technol. Res. Inst., Hsinchu, Taiwan
         
        
        
        
            Abstract : 
Electrical performance of a light-induced degraded amorphous thin film (a-Si:H) module was investigated at various recovery temperature ranging from 25 to 65°C. Fill factor (FF) was proposed to describe the module performance due to its sensitivity to the resistance characteristics of module and environment parameters. The ground state of the a-Si:H module was 59.1% in fill factor, while an exponential increase in FF finally leaded to a saturated state around 60.6% with the increasing module temperature. Obviously, it is suggested that the recovery behavior of a-Si:H module occurs when heating up the module, and the performance itself is influenced by annealing parameters. Yet, a further assessment of the electrical parameters indicated that the increase of the FF was mainly dominated by the decrease of the series resistance (Rs).
         
        
            Keywords : 
amorphous semiconductors; annealing; ground states; hydrogen; semiconductor thin films; silicon; solar cells; Si:H; amorphous silicon solar module; amorphous thin film; annealing parameters; electrical parameters; electrical performance; environment parameters; fill factor; ground state; light induced degraded thin film; low temperature; series resistance; temperature 25 degC to 65 degC; Amorphous materials; Amorphous silicon; Degradation; Electric resistance; Heat recovery; Land surface temperature; Stationary state; Temperature distribution; Temperature sensors; Transistors; amorphous thin film; exponential behavior; fill factor; series resistance;
         
        
        
        
            Conference_Titel : 
Photovoltaic Specialists Conference (PVSC), 2009 34th IEEE
         
        
            Conference_Location : 
Philadelphia, PA
         
        
        
            Print_ISBN : 
978-1-4244-2949-3
         
        
            Electronic_ISBN : 
0160-8371
         
        
        
            DOI : 
10.1109/PVSC.2009.5411636