A first approach on the failure mechanisms of IGBT inverters for aeronautical applications: Effect of humidity-pressure combination

Author

Abbad, H. ; Azzopardi, S. ; Woirgard, E. ; Deletage, J.Y. ; Rollin, P. ; Marchand, K. ; Lhommeau, T. ; Piton, M.

Author_Institution

Lab. IMS, Univ. de Bordeaux, Talence, France

fYear

2010

fDate

21-24 June 2010

Firstpage

2450

Lastpage

2456

Abstract

Comparing to the most common reliability tests this work presents a new approach of accelerated testing, by combining temperature, humidity and pressure cycling with voltage stress. A design of experiments methodology has been proposed to test IGBT inverters and understand environmental factors effect. The humidity-pressure combination effect is studied for various IGBT inverter packaging materials.

Keywords

avionics; circuit reliability; circuit testing; design of experiments; electronics packaging; insulated gate bipolar transistors; invertors; life testing; space vehicle electronics; IGBT inverter packaging materials; accelerated testing; aeronautical applications; design of experiment methodology; environmental factors; failure mechanisms; humidity-pressure combination; pressure cycling; reliability tests; voltage stress; Design methodology; Failure analysis; Humidity; Insulated gate bipolar transistors; Inverters; Life estimation; Stress; Temperature; Testing; Voltage; IGBT; Reliability; design of experiments; failure mechanisms; multiphysics simulation;

fLanguage

English

Publisher

ieee

Conference_Titel

Power Electronics Conference (IPEC), 2010 International

Conference_Location

Sapporo

Print_ISBN

978-1-4244-5394-8

Type

conf

DOI

10.1109/IPEC.2010.5542388

Filename

5542388