• DocumentCode
    3447969
  • Title

    Novel Semiconductor Illumination Technique Based on Color Complementation

  • Author

    Song, Wenlong ; Wei, Wei ; Liu, Yaqiu

  • Author_Institution
    Northeast Forestry Univ. Harbin, Longjiang
  • fYear
    2007
  • fDate
    23-25 May 2007
  • Firstpage
    2036
  • Lastpage
    2039
  • Abstract
    The light source is a main part in an image acquisition system, and LED light sources have been widely used in this field for their merits of shape flexibility, long service life, high frequency response, rich colors and low cost. In this paper, light emitting mechanism of LEDs and their spectral characteristics are firstly analyzed and the color complementation method in white LED design is introduced; then a novel illumination method based on color complementation is proposed according to rich colors of LEDs, in which high contrast images can be obtained with selective use of different color light sources after color analysis of the imaging object and background. Experimental results in vision inspection of ICs with ball grid array package (BGA) and chip scale package (CSP) show that with the method proposed, ineffective background information of images can be effectively filtered, data volume of images is significantly reduced and consequently the speed and precision of image processing is greatly improved.
  • Keywords
    ball grid arrays; chip scale packaging; image colour analysis; light emitting diodes; lighting; LED light sources; ball grid array package; chip scale package; color analysis; color complementation; high contrast images; high frequency response; image acquisition system; light emitting mechanism; long service life; semiconductor illumination technique; shape flexibility; vision inspection; Chip scale packaging; Costs; Frequency response; Image analysis; Image color analysis; Inspection; Light emitting diodes; Light sources; Lighting; Shape;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Electronics and Applications, 2007. ICIEA 2007. 2nd IEEE Conference on
  • Conference_Location
    Harbin
  • Print_ISBN
    978-1-4244-0737-8
  • Electronic_ISBN
    978-1-4244-0737-8
  • Type

    conf

  • DOI
    10.1109/ICIEA.2007.4318767
  • Filename
    4318767