• DocumentCode
    3449298
  • Title

    Delay factors for mainframe computers

  • Author

    Davidson, Evan

  • Author_Institution
    IBM Corp., Hopewell Junction, NY, USA
  • fYear
    1991
  • fDate
    9-10 Sep 1991
  • Firstpage
    116
  • Lastpage
    123
  • Abstract
    In many modern machines, the package has become a major component of the delays that determine the system´s performance. The factors leading to this observation are discussed. Included in the discussion are all the path delay components, which encompass chip delay, propagation delay, loading delay, noise-induced delay, clock skews, and tolerances. Techniques for reducing these components in future mainframe designs are introduced. In addition, an argument that states the continuing need for bipolar-based mainframe technologies is given
  • Keywords
    delays; mainframes; packaging; bipolar-based mainframe technologies; chip delay; clock skews; loading delay; mainframe computers; noise-induced delay; package; path delay components; propagation delay; tolerances; CMOS technology; Central Processing Unit; Circuits; Computer aided instruction; Costs; Packaging machines; Propagation delay; Supercomputers; System performance; Workstations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Bipolar Circuits and Technology Meeting, 1991., Proceedings of the 1991
  • Conference_Location
    Minneapolis, MN
  • Print_ISBN
    0-7803-0103-X
  • Type

    conf

  • DOI
    10.1109/BIPOL.1991.160968
  • Filename
    160968