DocumentCode
3449298
Title
Delay factors for mainframe computers
Author
Davidson, Evan
Author_Institution
IBM Corp., Hopewell Junction, NY, USA
fYear
1991
fDate
9-10 Sep 1991
Firstpage
116
Lastpage
123
Abstract
In many modern machines, the package has become a major component of the delays that determine the system´s performance. The factors leading to this observation are discussed. Included in the discussion are all the path delay components, which encompass chip delay, propagation delay, loading delay, noise-induced delay, clock skews, and tolerances. Techniques for reducing these components in future mainframe designs are introduced. In addition, an argument that states the continuing need for bipolar-based mainframe technologies is given
Keywords
delays; mainframes; packaging; bipolar-based mainframe technologies; chip delay; clock skews; loading delay; mainframe computers; noise-induced delay; package; path delay components; propagation delay; tolerances; CMOS technology; Central Processing Unit; Circuits; Computer aided instruction; Costs; Packaging machines; Propagation delay; Supercomputers; System performance; Workstations;
fLanguage
English
Publisher
ieee
Conference_Titel
Bipolar Circuits and Technology Meeting, 1991., Proceedings of the 1991
Conference_Location
Minneapolis, MN
Print_ISBN
0-7803-0103-X
Type
conf
DOI
10.1109/BIPOL.1991.160968
Filename
160968
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