Title :
A fabrication method of the micro resonant beam compliant to unfitted thickness
Author :
Jiandong Jin ; Mingwei Wang ; Yuling Li ; Hong Qi
Author_Institution :
49th Res. Inst., Eng. Center of Chip & Microsyst., CETC, Harbin, China
Abstract :
This papers presents a simple bulk micro fabrication method for micro resonant beams based monocrystalline silicon wafer. Experimental results show that the thickness of the micro resonant beams is highly uniform, the length and width of the resonant beams are determined by photolithography, the thickness of the beam, the gap between the beam and Si substrate are determined by the DRIE. The thickness and gap are adjustable in a large range.
Keywords :
elemental semiconductors; etching; micro-optomechanical devices; microfabrication; optical fabrication; photolithography; silicon; DRIE; Si; Si substrate; bulk microfabrication; deep reactive ion etching; microresonant beam compliant; monocrystalline silicon wafer; photolithography; unfitted thickness; Cavity resonators; Etching; Fabrication; Resonant frequency; Silicon; Substrates; (111)wafer; anisotropic etching; resonant beam;
Conference_Titel :
Optoelectronics and Microelectronics (ICOM), 2013 International Conference on
Conference_Location :
Harbin
Print_ISBN :
978-1-4799-1214-8
DOI :
10.1109/ICoOM.2013.6626488
