Electromagnetic modeling of package parasitics in SAW-duplexer

Author

Makkonen, Tapani ; Plessky, Victor P. ; Kondratiev, Sergei ; Salomaa, Martti M.

Author_Institution

Micronas Semicond. SA, Bevaix, Switzerland

Volume

1

fYear

1996

fDate

3-6 Nov 1996

Firstpage

29

Abstract

We model the inductive and capacitive parasitic electromagnetic couplings in a packaged surface-acoustic wave (SAW) antenna duplexer. Theoretical estimates for self- and mutual inductances of the bond wires are computed in the presence of two ground planes. An equivalent circuit for the duplexer including the parasitic elements is presented. The frequency response of the duplexer is predicted with the help of circuit simulation. The modeling is further refined with optimization of the model parameters to improve the fit between the measured and simulated responses

Keywords

antenna accessories; circuit analysis computing; coupled mode analysis; equivalent circuits; frequency response; inductance; skin effect; surface acoustic wave devices; surface mount technology; 900 to 930 MHz; COM model; SAW antenna duplexer; SMD ceramic package; bond wires; capacitive parasitic electromagnetic coupling; circuit simulation; electromagnetic modeling; equivalent circuit; frequency response; ground planes; inductive parasitic electromagnetic coupling; model parameter optimization; mutual inductance; package parasitics; proximity effect; self-inductance; skin effect; Bonding; Circuit simulation; Electromagnetic coupling; Electromagnetic modeling; Equivalent circuits; Estimation theory; Packaging; Surface acoustic waves; Surface waves; Wires;

fLanguage

English

Publisher

ieee

Conference_Titel

Ultrasonics Symposium, 1996. Proceedings., 1996 IEEE

Conference_Location

San Antonio, TX

ISSN

1051-0117

Print_ISBN

0-7803-3615-1

Type

conf

DOI

10.1109/ULTSYM.1996.583777

Filename

583777