Title :
Lead-free soldering process for coil terminals by using atmospheric pressure plasma technique
Author :
Saito, Masato ; Okumura, Tomohiro ; Nishikawa, Kazutaka ; Suetsugu, Kenichiro
Keywords :
Atmospheric-pressure plasmas; Cable insulation; Copper; Electrodes; Environmentally friendly manufacturing techniques; Lead; Plasma applications; Plasma measurements; Soldering; Wire;
Conference_Titel :
Microprocesses and Nanotechnology Conference, 2004. Digest of Papers. 2004 International
Print_ISBN :
4-99024720-5
DOI :
10.1109/IMNC.2004.245714
