DocumentCode
3452341
Title
Lead-free soldering process for coil terminals by using atmospheric pressure plasma technique
Author
Saito, Masato ; Okumura, Tomohiro ; Nishikawa, Kazutaka ; Suetsugu, Kenichiro
fYear
2004
fDate
Oct. 27-29, 2004
Firstpage
46
Lastpage
47
Keywords
Atmospheric-pressure plasmas; Cable insulation; Copper; Electrodes; Environmentally friendly manufacturing techniques; Lead; Plasma applications; Plasma measurements; Soldering; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Microprocesses and Nanotechnology Conference, 2004. Digest of Papers. 2004 International
Print_ISBN
4-99024720-5
Type
conf
DOI
10.1109/IMNC.2004.245714
Filename
1459464
Link To Document