Title :
12-in. wafer imprinting using soft mold and gas pressure mechanism
Author :
Cheng, E.S. ; Weng, K.C. ; Yang, S.X. ; Wang, L.A.
Keywords :
Assembly; Heating; Mechanical engineering; Nitrogen; Pressing; Resists; Seals; Substrates; Temperature; Throughput;
Conference_Titel :
Microprocesses and Nanotechnology Conference, 2004. Digest of Papers. 2004 International
Print_ISBN :
4-99024720-5
DOI :
10.1109/IMNC.2004.245726
