3452765

Silicon on Insulator CMOS with Hybrid Crystal Orientation Using Double Wafer Bonding

Chan, K.K. ; Yang, M. ; Shi, L. ; Kumar, A. ; Ott, J.A. ; Patel, J. ; Schultz, R. ; Kry, H. ; Zhang, Y. ; Sikorski, E. ; Graham, W. ; To, B. ; Medd, S. ; Canaperi, D. ; Newbury, J. ; Scerbo, C. ; Meyer, R. ; Emic, C.D. ; Ieong, M.

IBM Semiconductor Research and Development Center, Research Division, T.J. Watson Research Center, Yorktown Heights, NY 10598. Email: kkchan@us.IBM.com, Phone : (914)945-3166, Fax : (914)945-2141

2006

26-28 June 2006

41

42

CMOS process; CMOS technology; Etching; Fabrication; Oxidation; Silicon on insulator technology; Substrates; Temperature; Voltage; Wafer bonding;

English

ieee

Device Research Conference, 2006 64th

State College, PA, USA

1548-3770

0-7803-9748-7

conf

10.1109/DRC.2006.305110

4097527