The plastic and creep behavior of silicon microstructure at high temperature

This paper presents an experimental method to investigate the plastic and creep behavior of single crystal silicon (SCS) microstructure at high temperature. The relationship between plastic deformation and structure dimensions is demonstrated, and the creep curve of microstructure is firstly reported. The plastic and creep behavior of SCS microstructure, which consists of a square diaphragm with a center boss and a vacuum cavity, was investigated by measuring the deformation of the microstructure after undergoing a series of high temperature processes. The experiment results show that the plastic deformation is in inverse ratio to the cube of the diaphragm thickness. The obvious creep was observed at 1100°C. The creep rate decreased with time and then became nearly constant.