• DocumentCode
    3453730
  • Title

    CMOS ESD protection structures-characteristics and performance comparison

  • Author

    Fried, Rafael ; Blecher, Yaron ; Friedman, Shimon

  • Author_Institution
    Nat. Semicond. (IC) Ltd., Herzliya, Israel
  • fYear
    1995
  • fDate
    11-14 Oct 1995
  • Firstpage
    567
  • Lastpage
    570
  • Abstract
    The performance of ESD protection structures is highly dependent on process parameters, circuit and layout effects, and the structure´s area and geometry. The goal of the work reported here was to produce the best ESD protection structure in a standard 0.8 μm N-well CMOS LDD non-silicided process, under the constraint of a given area that is dictated by the pad´s pitch (132 μm×65 μm), and without adding steps to the process. Basic building blocks of CMOS ESD protection structures are reviewed. Layout and circuit effects are discussed. Several ESD protection structures were tested and their performance was compared. DC characteristics and ESD zapping results are reported. 10 kV HBM ESD protection structures are disclosed
  • Keywords
    CMOS integrated circuits; electrostatic discharge; integrated circuit layout; integrated circuit technology; protection; 0.8 micron; 10 kV; CMOS ESD protection structures; DC characteristics; LDD nonsilicided process; layout effects; standard N-well CMOS process; Bipolar transistors; Diodes; Electric breakdown; Electrostatic discharge; Fingers; MOS devices; Protection; Resistors; Stress; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Conference, 1995. CAS'95 Proceedings., 1995 International
  • Conference_Location
    Sinaia
  • Print_ISBN
    0-7803-2647-4
  • Type

    conf

  • DOI
    10.1109/SMICND.1995.495080
  • Filename
    495080