DocumentCode
3453730
Title
CMOS ESD protection structures-characteristics and performance comparison
Author
Fried, Rafael ; Blecher, Yaron ; Friedman, Shimon
Author_Institution
Nat. Semicond. (IC) Ltd., Herzliya, Israel
fYear
1995
fDate
11-14 Oct 1995
Firstpage
567
Lastpage
570
Abstract
The performance of ESD protection structures is highly dependent on process parameters, circuit and layout effects, and the structure´s area and geometry. The goal of the work reported here was to produce the best ESD protection structure in a standard 0.8 μm N-well CMOS LDD non-silicided process, under the constraint of a given area that is dictated by the pad´s pitch (132 μm×65 μm), and without adding steps to the process. Basic building blocks of CMOS ESD protection structures are reviewed. Layout and circuit effects are discussed. Several ESD protection structures were tested and their performance was compared. DC characteristics and ESD zapping results are reported. 10 kV HBM ESD protection structures are disclosed
Keywords
CMOS integrated circuits; electrostatic discharge; integrated circuit layout; integrated circuit technology; protection; 0.8 micron; 10 kV; CMOS ESD protection structures; DC characteristics; LDD nonsilicided process; layout effects; standard N-well CMOS process; Bipolar transistors; Diodes; Electric breakdown; Electrostatic discharge; Fingers; MOS devices; Protection; Resistors; Stress; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Conference, 1995. CAS'95 Proceedings., 1995 International
Conference_Location
Sinaia
Print_ISBN
0-7803-2647-4
Type
conf
DOI
10.1109/SMICND.1995.495080
Filename
495080
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