Title :
Design and Use of Wafer Level Fluidic Packaging for Surface Acoustic Wave Sensors
Author :
Friedt, J.-M. ; El Fissi, L. ; Chérioux, F. ; Guichardaz, B. ; Blondeau-Patissier, V. ; Ballandras, S.
Author_Institution :
SENSeOR, Sophia Antipolis
fDate :
May 29 2007-June 1 2007
Abstract :
We demonstrate the propagation of a Love mode acoustic wave in a thin SU8 epoxy layer coating a AT-cut quartz substrate: the resulting insertion losses are observed in the -35 to -40 dB range. We demonstrate the packaging of this device in a SU8 microfluidic system preventing liquids from covering the interdigitated transducer while defining the chemical reaction area in the region between the interdigitated transducer. We demonstrate the ability to chemically functionalize the SU8 layer with amine-ended groups. Finally, a time-resolved adsorption of small (600 daltons) organometallic molecules is presented for illustrating the detection sensitivity and selectivity of the resulting sensor working with analytes in aqueous solutions.
Keywords :
microfluidics; semiconductor device packaging; surface acoustic wave sensors; AT-cut quartz substrate; Love mode acoustic wave; SU8 microfluidic system; amine-ended groups; chemical reaction area; insertion losses; interdigitated transducer; organometallic molecules; surface acoustic wave sensors; thin SU8 epoxy layer coating; time-resolved adsorption; wafer level fluidic packaging; Acoustic propagation; Acoustic sensors; Acoustic waves; Chemical transducers; Coatings; Insertion loss; Packaging; Surface acoustic wave devices; Surface acoustic waves; Wafer scale integration;
Conference_Titel :
Frequency Control Symposium, 2007 Joint with the 21st European Frequency and Time Forum. IEEE International
Conference_Location :
Geneva
Print_ISBN :
978-1-4244-0646-3
Electronic_ISBN :
1075-6787
DOI :
10.1109/FREQ.2007.4319099