Title :
Spice simulations of DC electrothermal interactions in bipolar electronic circuits
Author :
Zarebski, Janusz
Author_Institution :
Dept. of Radioelectron., Gdynia Maritime Acad., Morska, Poland
Abstract :
This paper is devoted to the problem of analysis of electronic circuits with thermal effects taken into account. Such analysis-called the electrothermal analysis-can be performed by means of the modified SPICE user. In this case the electrothermal analysis demands formulating the electrothermal device models in the proper circuital form. Two types of electrothermal models of the BJT: the global electrothermal model (GETM) and the hybrid electrothermal model (HETM) have been presented. These models were implemented in the form of subcircuits. To make this analysis possible, the STER program supervising SPICE was elaborated
Keywords :
SPICE; bipolar integrated circuits; circuit CAD; circuit simulation; integrated circuit design; BJT; DC electrothermal interactions; SPICE simulations; STER program; bipolar electronic circuits; global electrothermal model; hybrid electrothermal model; subcircuits; Circuit analysis; Circuit simulation; Electronic circuits; Electrothermal effects; Performance analysis; SPICE; Semiconductor devices; Temperature dependence; Virtual manufacturing; Voltage;
Conference_Titel :
Electronics, Circuits and Systems, 1998 IEEE International Conference on
Conference_Location :
Lisboa
Print_ISBN :
0-7803-5008-1
DOI :
10.1109/ICECS.1998.814829