Spice simulations of DC electrothermal interactions in bipolar electronic circuits

Author

Zarebski, Janusz

Author_Institution

Dept. of Radioelectron., Gdynia Maritime Acad., Morska, Poland

Volume

2

fYear

1998

fDate

1998

Firstpage

77

Abstract

This paper is devoted to the problem of analysis of electronic circuits with thermal effects taken into account. Such analysis-called the electrothermal analysis-can be performed by means of the modified SPICE user. In this case the electrothermal analysis demands formulating the electrothermal device models in the proper circuital form. Two types of electrothermal models of the BJT: the global electrothermal model (GETM) and the hybrid electrothermal model (HETM) have been presented. These models were implemented in the form of subcircuits. To make this analysis possible, the STER program supervising SPICE was elaborated

Keywords

SPICE; bipolar integrated circuits; circuit CAD; circuit simulation; integrated circuit design; BJT; DC electrothermal interactions; SPICE simulations; STER program; bipolar electronic circuits; global electrothermal model; hybrid electrothermal model; subcircuits; Circuit analysis; Circuit simulation; Electronic circuits; Electrothermal effects; Performance analysis; SPICE; Semiconductor devices; Temperature dependence; Virtual manufacturing; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics, Circuits and Systems, 1998 IEEE International Conference on

Conference_Location

Lisboa

Print_ISBN

0-7803-5008-1

Type

conf

DOI

10.1109/ICECS.1998.814829

Filename

814829