Title :
Highly flexible membrane systems for micromachined microphones - modeling and simulation
Author :
Tounsi, F. ; Rufer, L. ; Mezghani, B. ; Masmoudi, M. ; Mir, S.
Author_Institution :
Electron., Microtechnol. & Commun. (EMC) Res. Group, Nat. Eng. Sch. of Sfax, Sfax, Tunisia
Abstract :
This paper presents a mechanical modeling of membrane systems applicable to micromachined microphones requiring a low stiffness constant. We have recently developed a single-chip electrodynamic microphone in a CMOS MEMS technology. The microphone consists of a suspended square membrane of 1.4 mm side, 3 ¿m thick and 10 ¿g, and two concentric inductors. This suspended moving membrane is fixed to the substrate with 4 attachments arms. In order to achieve a desired flat frequency response characteristic, covering the entire acoustic band, several attachment designs are presented, studied and compared. These designs include crab-leg, meander, U-spring and serpentine forms. We have found that for comparable dimensions, the U-spring form presents the highest compliance and the meander type is the stiffest.
Keywords :
CMOS integrated circuits; elastic constants; electrodynamics; micromachining; micromechanical devices; microphones; CMOS MEMS technology; U-spring; concentric inductors; electrodynamic microphone; highly flexible membrane systems; mechanical modeling; micromachined microphones; micromachining process; serpentine; single-chip electrodynamic microphone; stiffness constant; Acoustic sensors; Arm; Biomembranes; CMOS technology; Electrodynamics; Fabrication; Frequency; Microphones; Semiconductor device modeling; Silicon; Electrodynamic transducer; mechanical modeling; silicon micromachining; spring modeling;
Conference_Titel :
Signals, Circuits and Systems (SCS), 2009 3rd International Conference on
Conference_Location :
Medenine
Print_ISBN :
978-1-4244-4397-0
Electronic_ISBN :
978-1-4244-4398-7
DOI :
10.1109/ICSCS.2009.5412255
