Wafer-level fabricated micro beam splitter based on 45-degree saw dicing of glass substrate

This work presents the development of an integrated micro-optical beam splitter that can be arranged in array, and based on saw-dicing of glass substrates. The latter allows a rapid and rather low-cost processing, and in addition leads to high compactness and possibility of wafer level alignments, suitable for vertically integrated imaging microinstruments. The device allowing additional out-of plane reflection for extraction of sensing beam can be as small as 1mm³.