Title :
Hermetically encapsulated differential resonant accelerometer
Author :
Christensen, David L. ; Ahn, Chong H. ; Hong, Vu A. ; Ng, Eldwin Jiaqiang ; Yang, Yi ; Lee, B.J. ; Kenny, Thomas W.
Author_Institution :
Dept. of Mech. Eng., Stanford Univ., Stanford, CA, USA
Abstract :
We demonstrate the first accelerometer with a resonant strain gauge displacement transducer fabricated in a wafer-scale encapsulation process. Co-fabrication of this device with ultra-stable resonators enables detection of acceleration, and measurement of temperature (for compensation), along with generation of the timing reference for acceleration measurement.
Keywords :
accelerometers; compensation; micromechanical resonators; strain gauges; temperature measurement; wafer level packaging; acceleration detection; hermetically encapsulated differential resonant accelerometer; resonant strain gauge displacement transducer; temperature compensation measurement; timing reference; wafer-scale encapsulation process; Acceleration; Accelerometers; Performance evaluation; Resonant frequency; Sensitivity; Sensors; Temperature measurement; Resonant accelerometer; wafer-scale packaging;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), 2013 Transducers & Eurosensors XXVII: The 17th International Conference on
Conference_Location :
Barcelona
DOI :
10.1109/Transducers.2013.6626839
