DocumentCode
3455346
Title
Hermetically encapsulated differential resonant accelerometer
Author
Christensen, David L. ; Ahn, Chong H. ; Hong, Vu A. ; Ng, Eldwin Jiaqiang ; Yang, Yi ; Lee, B.J. ; Kenny, Thomas W.
Author_Institution
Dept. of Mech. Eng., Stanford Univ., Stanford, CA, USA
fYear
2013
fDate
16-20 June 2013
Firstpage
606
Lastpage
609
Abstract
We demonstrate the first accelerometer with a resonant strain gauge displacement transducer fabricated in a wafer-scale encapsulation process. Co-fabrication of this device with ultra-stable resonators enables detection of acceleration, and measurement of temperature (for compensation), along with generation of the timing reference for acceleration measurement.
Keywords
accelerometers; compensation; micromechanical resonators; strain gauges; temperature measurement; wafer level packaging; acceleration detection; hermetically encapsulated differential resonant accelerometer; resonant strain gauge displacement transducer; temperature compensation measurement; timing reference; wafer-scale encapsulation process; Acceleration; Accelerometers; Performance evaluation; Resonant frequency; Sensitivity; Sensors; Temperature measurement; Resonant accelerometer; wafer-scale packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), 2013 Transducers & Eurosensors XXVII: The 17th International Conference on
Conference_Location
Barcelona
Type
conf
DOI
10.1109/Transducers.2013.6626839
Filename
6626839
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