DocumentCode
3455721
Title
Fabrication of 2.5 GHz SAW retiming filter with SiO2/ZnO/diamond structure
Author
Nakahata, H. ; Kitabayashi, H. ; Fujii, S. ; Higaki, K. ; Tanabe, K. ; Seki, Y. ; Shikata, S.
Author_Institution
Itami Res. Labs., Sumitomo Electr. Ind. Ltd., Hyogo, Japan
Volume
1
fYear
1996
fDate
3-6 Nov 1996
Firstpage
285
Abstract
The variety of layered structures with a diamond film are expected to be applied for high-frequency SAW devices due to their high velocities. The SiO2/ZnO/IDT/diamond structure is one of the promising, especially for high-frequency and narrow-band filters. In this paper, the 1st mode SAW in the SiO2/ZnO/IDT/diamond structure was experimentally studied, and confirmed that it can provide zero temperature coefficient of frequency (TCF) as well as high velocity of 9,000 m/s. A 2.5 GHz narrow-band SAW filter was successfully fabricated with this structure with IDTs of 0.9 μm finger width, and it was shown that this filter has practical and superior characteristics for the 2.5 GHz retiming filter. Its insertion loss was 10 dB that is smaller than ever reported with quartz
Keywords
UHF filters; diamond; interdigital transducers; silicon compounds; surface acoustic wave filters; timing; zinc compounds; 0.9 micron; 10 dB; 2.5 GHz; 9000 m/s; IDT; SAW retiming filter; SiO2-ZnO-C; SiO2/ZnO/diamond layered structure; fabrication; high-frequency narrow-band device; insertion loss; temperature coefficient of frequency; velocity; Fabrication; Fingers; Frequency; Insertion loss; Narrowband; SAW filters; Surface acoustic wave devices; Surface acoustic waves; Temperature; Zinc oxide;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium, 1996. Proceedings., 1996 IEEE
Conference_Location
San Antonio, TX
ISSN
1051-0117
Print_ISBN
0-7803-3615-1
Type
conf
DOI
10.1109/ULTSYM.1996.583975
Filename
583975
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