DocumentCode :
3455746
Title :
Performance evaluation of on-chip sensor network (SENoC) in MPSoC
Author :
Wang, Yao ; Wang, Yu ; Xu, Jiang ; Yang, Huazhong
Author_Institution :
EE. Dept, Tsinghua Univ., Beijing, China
fYear :
2010
fDate :
21-23 June 2010
Firstpage :
323
Lastpage :
327
Abstract :
As technology scaling, more processing units (PUs) are integrated in multiprocessor system-on-chip (MPSoC) to achieve higher performance. Due to the higher variations resulted from reducing feature sizes and the needs of lower power consumption, on-chip monitoring of environmental information, such as thermal, voltage, and frequency, is becoming increasingly important. To address this need, sensors are integrated into network-on-chip (NoC) to perform system monitoring. However, sensors which transfer their data through NOC will compete with PUs for the limited bandwidth resources, thus communication between PUs will be delayed. To evaluate the sensors´ overhead on the regular data traffic, we implement a VC based NoC. The sensor data are transferred through NoC together with the regular data. We study the average delay of regular data and sensor data, respectively. We compare the experimental results with that of a NOC without sensors. The results show that the overhead of sensors is negligible, with a max delay overhead of 0.80% when the traffic is not that heavy.
Keywords :
multiprocessing systems; network-on-chip; performance evaluation; system monitoring; MPSoC; NoC; bandwidth resources; data traffic; low power consumption; max delay overhead; multiprocessor system-on-chip; network-on-chip; on-chip monitoring; on-chip sensor network performance evaluation; processing units; sensor data; sensor overhead evaluation; system monitoring; Bandwidth; Delay; Energy consumption; Frequency; Monitoring; Multiprocessing systems; Network-on-a-chip; Sensor systems; Telecommunication traffic; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Green Circuits and Systems (ICGCS), 2010 International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-6876-8
Electronic_ISBN :
978-1-4244-6877-5
Type :
conf
DOI :
10.1109/ICGCS.2010.5543046
Filename :
5543046
Link To Document :
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