DocumentCode
3455765
Title
Energy-efficient techniques for circuit design in network-on-chip platforms
Author
Huang, Po-Tsang ; Hwang, Wei
Author_Institution
Dept. of Electron. Eng., Nat. Chiao-Tung Univ., Hsinchu, Taiwan
fYear
2010
fDate
21-23 June 2010
Firstpage
305
Lastpage
310
Abstract
Advanced network-on-chip (NOC) designs using nano-scale technologies face a number of challenges, especially for great amount of energy consumption in switch fabrics and link wires. In this paper, some energy-efficient techniques are presented for circuit design in network-on-chip platforms, including low-power and variation-tolerant link wires, adaptive congestion-aware routing and asynchronous two-level FIFO buffers. Energy-efficient and reliable link wires are provided by a novel self-calibrated low-power coding and voltage scaling interconnection architecture. This approach makes the NoC applications tolerant of transient malfunctions and realizes energy efficiency. Additionally, an adaptive congestion-aware routing is proposed to reduce the average latencies by avoiding the congestion conditions and distributed hotspots. Moreover, an asynchronous two-level FIFO buffer can reduce energy consumption compared with that of synchronous two-level FIFO buffers and conventional asynchronous output buffers.
Keywords
energy conservation; integrated circuit design; integrated circuit interconnections; network-on-chip; NOC design; adaptive congestion-aware routing; asynchronous two-level FIFO buffers; circuit design; energy consumption; energy efficient techniques; nanoscale technologies; network-on-chip platforms; self-calibrated low-power coding; switch fabrics; transient malfunctions; variation tolerant link wires; voltage scaling interconnection architecture; Circuit synthesis; Energy consumption; Energy efficiency; Fabrics; Integrated circuit interconnections; Network-on-a-chip; Routing; Switches; Voltage; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Green Circuits and Systems (ICGCS), 2010 International Conference on
Conference_Location
Shanghai
Print_ISBN
978-1-4244-6876-8
Electronic_ISBN
978-1-4244-6877-5
Type
conf
DOI
10.1109/ICGCS.2010.5543047
Filename
5543047
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