DocumentCode :
3455970
Title :
Single chip process for sensors implementation, integration, and condition monitoring
Author :
Cheng, C.-W. ; Liang, K.-C. ; Chu, C.-H. ; Horsley, David A. ; Fang, Wanliang
Author_Institution :
Taiwan Semicond. Manuf. Co. (TSMC) Ltd., Hsinchu, Taiwan
fYear :
2013
fDate :
16-20 June 2013
Firstpage :
730
Lastpage :
733
Abstract :
This study presents the development of a foundry available process scheme for MEMS devices. Such MEMS process scheme enables integration of various MEMS sensors with Pirani gauge. In applications, this study has employed such bulk Si with embedded poly plug process scheme to demonstrate various MEMS devices of different vacuum requirement, including resonators, accelerometer, gyroscope, and magnetometers on single Si wafer. Moreover, a monolithically integrated silicon-based Pirani vacuum gauge to provide in situ pressure monitor for each device is also demonstrated.
Keywords :
condition monitoring; elemental semiconductors; microfabrication; microsensors; monolithic integrated circuits; pressure gauges; silicon; vacuum gauges; MEMS sensor device; Si; accelerometer; condition monitoring; embedded poly plug process scheme; foundry available process scheme; gyroscope; magnetometer; monolithically integrated silicon-based Pirani vacuum gauge; pressure monitoring; resonator; single chip process; vacuum requirement; Accelerometers; Gyroscopes; Magnetic sensors; Magnetometers; Micromechanical devices; Silicon; Accelerometer; Gyroscope; MEMS device integration; Magnetometers; Pirani gauge; Resonators;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), 2013 Transducers & Eurosensors XXVII: The 17th International Conference on
Conference_Location :
Barcelona
Type :
conf
DOI :
10.1109/Transducers.2013.6626870
Filename :
6626870
Link To Document :
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