• DocumentCode
    3456137
  • Title

    Atomically-precise three-dimensional top down fabrication

  • Author

    Ballard, J.B. ; Owen, J.H.G. ; Fuchs, Emmerich ; McDonnell, S. ; Dick, D. ; Mordi, G. ; Azcatl, A. ; Seitz, O. ; Campbell, P. ; Veyan, J.F. ; Chabal, Y. ; Wallace, Robert M. ; Bischof, M. ; Jaeger, David ; Reidy, R. ; Sarkar, Niladri ; Randall, J.N.

  • Author_Institution
    Zyvex Labs., Richardson, TX, USA
  • fYear
    2013
  • fDate
    16-20 June 2013
  • Firstpage
    764
  • Lastpage
    767
  • Abstract
    Semiconductor manufacturing has provided a fabrication technology with ever-improving precision that is extremely cost-effective at producing transistors but provides poor relative precision at the limits of its resolution. Recent efforts at developing tip based nanofabrication are breaking out of 2D into 3D structures that achieve atomic precision with top down control. Coincidentally, applications that require atomic precision have begun to emerge. This talk will review progress towards atomically precise manufacturing, describe some of the near term applications such as nano electro mechanical systems, sensors, QuBit devices, and nanoimprint templates, and prospects for scaling up the throughput of atomically precise fabrication technology.
  • Keywords
    lithography; microfabrication; nanoelectromechanical devices; quantum computing; scanning tunnelling microscopy; semiconductor industry; sensors; 2D structures; 3D structures; QuBit devices; STM lithography; atomic precision; atomically-precise three-dimensional top down fabrication; nano electro mechanical systems; nanoimprint templates; review; semiconductor manufacturing; sensors; tip based nanofabrication; Arrays; Atomic layer deposition; Fabrication; Hardware design languages; Lithography; Silicon; Surface treatment; Atomically precise fabrication; STM lithography;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), 2013 Transducers & Eurosensors XXVII: The 17th International Conference on
  • Conference_Location
    Barcelona
  • Type

    conf

  • DOI
    10.1109/Transducers.2013.6626878
  • Filename
    6626878