DocumentCode :
3456204
Title :
Direct observation of damage accumulation process inside silicon under mechanical fatigue loading
Author :
Kamiya, Shinichiro ; Hirai, Riu ; Izumi, H. ; Umehara, N. ; Tokoroyama, T.
Author_Institution :
Nagoya Inst. of Technol., Nagoya, Japan
fYear :
2013
fDate :
16-20 June 2013
Firstpage :
784
Lastpage :
787
Abstract :
Fatigue test was performed on single crystal silicon under humid environment in an environmental scanning electron microscope. While the specimen was repeatedly subjected to compressive stress, electron beam induced current (EBIC) images were obtained to visualize damage evolution. Local contrast changes were successfully observed at the notch tip, which remained the same through the hydrofluoric acid treatment after the experiment. These facts suggest that damage evolved inside silicon crystal during the fatigue loading process and that the contrast change was not due to an oxide layer thickened on the surface.
Keywords :
compressive testing; dislocation etching; elemental semiconductors; fatigue; fatigue testing; scanning electron microscopy; silicon; EBIC; Si; compressive stress; damage accumulation process; electron beam induced current images; environmental scanning electron microscope; fatigue test; humid environment; hydrofluoric acid treatment; mechanical fatigue loading; notch tip; single crystal silicon; Compressive stress; Crystals; Fatigue; Loading; Silicon; Surface treatment; Defect; Dislocation; EBIC; Fatigue mechanism; Single crystalline silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), 2013 Transducers & Eurosensors XXVII: The 17th International Conference on
Conference_Location :
Barcelona
Type :
conf
DOI :
10.1109/Transducers.2013.6626883
Filename :
6626883
Link To Document :
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