Title :
Via hole modeling in Ka-band MMIC
Author :
Song, Ruiliang ; Ji, Xiaoyan ; Wang, Chunting
Author_Institution :
54th Res. Inst., China Electron. Technol. Corp., Shi Jiazhuang, China
Abstract :
Via hole in the monolithic microwave integrated circuit (MMIC) is very critical for the circuit performance in high frequency. Based on Maxwell equation by Ansoft HFSS simulation, the 3D electromagnetic (EM) model of conical via hole is established in Ka-band GaAs MMIC application. The relationship between the structural parameters and performance of circuit is investigated. Through the simulation, length and width of microstrip line connected to the via hole can make a great influence on the S parameter of via hole. Based on the fabricated chip, the model parameters matched the measurement results well.
Keywords :
MMIC; Maxwell equations; vias; 3D electromagnetic model; Ansoft HFSS simulation; Ka-band GaAs MMIC; Maxwell equation; conical via hole; monolithic microwave integrated circuit; via hole modeling; Gallium arsenide; Grounding; Integrated circuit modeling; MMICs; Mathematical model; Metals; Solid modeling; HFSS; MMIC; via hole;
Conference_Titel :
Millimeter Waves (GSMM), 2012 5th Global Symposium on
Conference_Location :
Harbin
Print_ISBN :
978-1-4673-1302-5
DOI :
10.1109/GSMM.2012.6314042
