• DocumentCode
    3456935
  • Title

    A MEMS based electrochemical seismic sensor

  • Author

    Deng, T. ; Chen, D.Y. ; Wang, J.B. ; Chen, Jiann-Jong ; He, W.T. ; Fan, Y.J.

  • Author_Institution
    Grad. Univ. of Chinese Acad. of Sci., Beijing, China
  • fYear
    2013
  • fDate
    16-20 June 2013
  • Firstpage
    920
  • Lastpage
    923
  • Abstract
    This paper presents a micro-electro-mechanical system (MEMS) based electrochemical seismic sensor where insulating spacers and sensing electrodes were contained in a plexiglass tube filled with an ion-rich electrolyte solution. Sensing electrodes and insulation spacers were fabricated based on MEMS processes and assembled by adhesive bonding in a layer-by-layer manner. The device performance was first characterized in a customized experimental platform, with a quantified bandwidth of 0.2-5 Hz and a linear voltage output as a function of the input vibration amplitude. A random-vibration testing in the laboratory environment was conducted, where response correlations among seven devices were calculated as 0.976±0.017, suggesting high device repeatability. This newly proposed seismic sensor may function as a promising seismic motion detecting device in the field of geophysical prospecting where low-frequency seismic motion detection is requested.
  • Keywords
    adhesive bonding; electrochemical electrodes; electrochemical sensors; electrolytes; insulation; microassembling; microfabrication; microsensors; pipes; seismometers; vibration measurement; MEMS based electrochemical seismic sensor; adhesive bonding; assembling; bandwidth 0.2 kHz to 5 Hz; input vibration amplitude; insulation spacer; ion-rich electrolyte solution; low-frequency seismic motion detection device; microelectromechanical system; plexiglass tube; random-vibration testing; sensing electrode; Accelerometers; Cathodes; Fabrication; Micromechanical devices; Sensors; Vibrations; MEMS; electrochemical approach; liquid proof mass; low-frequency; seismic sensor;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), 2013 Transducers & Eurosensors XXVII: The 17th International Conference on
  • Conference_Location
    Barcelona
  • Type

    conf

  • DOI
    10.1109/Transducers.2013.6626918
  • Filename
    6626918