DocumentCode :
3457098
Title :
System design of a 3D integrated non-isolated Point Of Load converter
Author :
Ball, Arthur ; Lim, Michele ; Gilham, David ; Lee, Fred C.
Author_Institution :
Bradley Dept. of Electr. & Comput. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA
fYear :
2008
fDate :
24-28 Feb. 2008
Firstpage :
181
Lastpage :
186
Abstract :
Thermal issues in the design of high-power and small-size non-isolated Point of Load (POL) converters have been significant and are becoming more so. If a heat sink is dispensed with, then a large area of multi-layer PCB material with significant amounts of copper is required for necessary cooling. A high-rate cooling fan is also necessary. So what at first seems like a small and elegant converter becomes bulky and challenging to position in the overall system when its thermal management is taken into account. This work finds a solution to these problems and investigates the use of Low- Temperature Co-fired Ceramic (LTCC) for integrating the inductor with the active stage. A buck POL is used to demonstrate these methodologies. The end result is a POL converter that can achieve full 20 A output current with no need for an external heat sink and no need for a cooling fan while providing a large step-down of 5 V to 1.2 V. High light- load efficiency of 92.2% is achieved and a high power density of 156 W/in3 including all the necessary thermal management, in natural convection condition, has been demonstrated.
Keywords :
cooling; fans; heat sinks; inductors; power convertors; thermal management (packaging); 3D integrated nonisolated point of load converter; heat sink; high-rate cooling fan; inductor; low-temperature co-fired ceramic; multilayer PCB material; natural convection condition; thermal management; Ceramics; Circuits; Cooling; Copper; Electronic packaging thermal management; Energy management; Heat sinks; Inductance; Switching frequency; Thermal management;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Applied Power Electronics Conference and Exposition, 2008. APEC 2008. Twenty-Third Annual IEEE
Conference_Location :
Austin, TX
ISSN :
1048-2334
Print_ISBN :
978-1-4244-1873-2
Electronic_ISBN :
1048-2334
Type :
conf
DOI :
10.1109/APEC.2008.4522719
Filename :
4522719
Link To Document :
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