• DocumentCode
    3457124
  • Title

    System in package with mounted capacitor for reduced parasitic inductance in voltage regulators

  • Author

    Hashimoto, T. ; Kawashima, T. ; Uno, T. ; Satou, Y. ; Matsuura, N.

  • Author_Institution
    Hitachi Res. Lab., Hitachi Ltd., Hitachi
  • fYear
    2008
  • fDate
    24-28 Feb. 2008
  • Firstpage
    187
  • Lastpage
    191
  • Abstract
    A system in package (SiP) on which an input capacitor is mounted has been developed for voltage regulators. The SiP offers the world´s lowest power dissipation of 3.8 W at 1 MHz. Its parasitic inductance is 44% lower than SiPs with the input capacitor mounted on the PCB, due to a small loop from the input capacitor to the MOSFETs, which reduces power dissipation by 25% at the same peak voltage. The high-side MOSFET die is flipped so that the drain electrode faces up, facilitating the connection of the MOSFET to the input capacitor. The lead frames and MOSFETs are connected with Cu leads, which reduce the spreading resistance of the MOSFET electrodes.
  • Keywords
    MOSFET; capacitors; system-in-package; voltage regulators; MOSFET drain electrode; SiP; frequency 1 MHz; mounted capacitor; power 3.8 W; reduced parasitic inductance; system in package; voltage regulator; Capacitors; Circuits; Inductance; Inductors; MOSFETs; Packaging; Regulators; Switching loss; Virtual reality; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applied Power Electronics Conference and Exposition, 2008. APEC 2008. Twenty-Third Annual IEEE
  • Conference_Location
    Austin, TX
  • ISSN
    1048-2334
  • Print_ISBN
    978-1-4244-1873-2
  • Electronic_ISBN
    1048-2334
  • Type

    conf

  • DOI
    10.1109/APEC.2008.4522720
  • Filename
    4522720