DocumentCode
3457124
Title
System in package with mounted capacitor for reduced parasitic inductance in voltage regulators
Author
Hashimoto, T. ; Kawashima, T. ; Uno, T. ; Satou, Y. ; Matsuura, N.
Author_Institution
Hitachi Res. Lab., Hitachi Ltd., Hitachi
fYear
2008
fDate
24-28 Feb. 2008
Firstpage
187
Lastpage
191
Abstract
A system in package (SiP) on which an input capacitor is mounted has been developed for voltage regulators. The SiP offers the world´s lowest power dissipation of 3.8 W at 1 MHz. Its parasitic inductance is 44% lower than SiPs with the input capacitor mounted on the PCB, due to a small loop from the input capacitor to the MOSFETs, which reduces power dissipation by 25% at the same peak voltage. The high-side MOSFET die is flipped so that the drain electrode faces up, facilitating the connection of the MOSFET to the input capacitor. The lead frames and MOSFETs are connected with Cu leads, which reduce the spreading resistance of the MOSFET electrodes.
Keywords
MOSFET; capacitors; system-in-package; voltage regulators; MOSFET drain electrode; SiP; frequency 1 MHz; mounted capacitor; power 3.8 W; reduced parasitic inductance; system in package; voltage regulator; Capacitors; Circuits; Inductance; Inductors; MOSFETs; Packaging; Regulators; Switching loss; Virtual reality; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Applied Power Electronics Conference and Exposition, 2008. APEC 2008. Twenty-Third Annual IEEE
Conference_Location
Austin, TX
ISSN
1048-2334
Print_ISBN
978-1-4244-1873-2
Electronic_ISBN
1048-2334
Type
conf
DOI
10.1109/APEC.2008.4522720
Filename
4522720
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