• DocumentCode
    3457163
  • Title

    On-chip bondwire transformers for power SOC applications

  • Author

    Lu, Jian ; Jia, Hongwei ; Arias, Andres ; Gong, Xun ; Shen, Z. John

  • Author_Institution
    Sch. of Electr. Eng. & Comput. Sci., Univ. of Central Florida, Orlando, FL
  • fYear
    2008
  • fDate
    24-28 Feb. 2008
  • Firstpage
    199
  • Lastpage
    204
  • Abstract
    In this paper, a novel concept of on-chip bondwire transformer with ferrite epoxy glob is proposed for power system on chip (SOC) applications. We have theoretically and experimentally proven the concept of the bondwire transformer and demonstrated that its performance can be improved using ferrite polymer epoxy glob. Transformer parameters including self- and mutual inductance, and coupling factors are extracted from both modeled and measured S-parameters. It is expected that the bondwire transformers can be easily integrated into power SOC manufacturing processes with minimal changes in processes, and open enormous possibilities for realizing cost- effective, high current, high efficiency power SOC´s.
  • Keywords
    power transformers; system-on-chip; coupling factors; ferrite polymer epoxy glob; mutual inductance; onchip bondwire transformers; power SOC applications; system on chip; Bonding; Ferrites; Inductance measurement; Mutual coupling; Polymers; Power system measurements; Power system modeling; Semiconductor device measurement; System-on-a-chip; Transformers; On-chip transformer; SOC; ferrite; wirebond;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applied Power Electronics Conference and Exposition, 2008. APEC 2008. Twenty-Third Annual IEEE
  • Conference_Location
    Austin, TX
  • ISSN
    1048-2334
  • Print_ISBN
    978-1-4244-1873-2
  • Electronic_ISBN
    1048-2334
  • Type

    conf

  • DOI
    10.1109/APEC.2008.4522722
  • Filename
    4522722