DocumentCode
3457163
Title
On-chip bondwire transformers for power SOC applications
Author
Lu, Jian ; Jia, Hongwei ; Arias, Andres ; Gong, Xun ; Shen, Z. John
Author_Institution
Sch. of Electr. Eng. & Comput. Sci., Univ. of Central Florida, Orlando, FL
fYear
2008
fDate
24-28 Feb. 2008
Firstpage
199
Lastpage
204
Abstract
In this paper, a novel concept of on-chip bondwire transformer with ferrite epoxy glob is proposed for power system on chip (SOC) applications. We have theoretically and experimentally proven the concept of the bondwire transformer and demonstrated that its performance can be improved using ferrite polymer epoxy glob. Transformer parameters including self- and mutual inductance, and coupling factors are extracted from both modeled and measured S-parameters. It is expected that the bondwire transformers can be easily integrated into power SOC manufacturing processes with minimal changes in processes, and open enormous possibilities for realizing cost- effective, high current, high efficiency power SOC´s.
Keywords
power transformers; system-on-chip; coupling factors; ferrite polymer epoxy glob; mutual inductance; onchip bondwire transformers; power SOC applications; system on chip; Bonding; Ferrites; Inductance measurement; Mutual coupling; Polymers; Power system measurements; Power system modeling; Semiconductor device measurement; System-on-a-chip; Transformers; On-chip transformer; SOC; ferrite; wirebond;
fLanguage
English
Publisher
ieee
Conference_Titel
Applied Power Electronics Conference and Exposition, 2008. APEC 2008. Twenty-Third Annual IEEE
Conference_Location
Austin, TX
ISSN
1048-2334
Print_ISBN
978-1-4244-1873-2
Electronic_ISBN
1048-2334
Type
conf
DOI
10.1109/APEC.2008.4522722
Filename
4522722
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