High-resolution strain sensing on steel by Silicon-On-Insulator flexural resonators fabricated with chip-level vacuum packaging

Author

Belsito, L. ; Ferri, M. ; Mancarella, F. ; Roncaglia, Alberto ; YAN, JIU DUN ; Seshia, Ashwin A. ; Soga, K.

Author_Institution

Inst. of Microelectron. & Microsyst., Bologna, Italy

fYear

2013

fDate

16-20 June 2013

Firstpage

992

Lastpage

995

Abstract

This paper reports on the fabrication and characterization of high-resolution strain sensors for steel based on Silicon On Insulator flexural resonators manufactured with chip-level LPCVD vacuum packaging. The sensors present high sensitivity (120 Hz/με), very high resolution (4 nε), low drift, and near-perfect reversibility in bending tests performed in both tensile and compressive strain regimes.

Keywords

chemical vapour deposition; chip scale packaging; dielectric resonators; silicon-on-insulator; steel; strain sensors; Si; bending tests; chip-level LPCVD vacuum packaging; chip-level vacuum packaging; compressive strain; high-resolution strain sensing; sensitivity; silicon-on-insulator flexural resonators; steel; tensile strain; Etching; Packaging; Resonant frequency; Sensors; Silicon-on-insulator; Steel; Strain; MEMS; SOI technology; Strain sensors; chip-level vacuum packaging; flexural resonators;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), 2013 Transducers & Eurosensors XXVII: The 17th International Conference on

Conference_Location

Barcelona

Type

conf

DOI

10.1109/Transducers.2013.6626936

Filename

6626936