Title :
Silicon nanowires honeycomb array fabrication with low-cost top-down technology on (111) silicon wafer
Author :
Xiao Yu ; Yuchen Wang ; Tie Li ; Yuelin Wang
Author_Institution :
State Key Labs. of Transducer Technol., Shanghai Inst. of Microsyst. & Inf. Technol., Shanghai, China
Abstract :
This paper presents a low-cost top-down fabrication technology for silicon nanowires (SiNWs) honeycomb array on a monolayer silicon wafer while only conventional micro-fabrication technology is required. Based on the anisotropic wet-etching mechanism for commercial (111) silicon wafer, highly downscaled silicon walls can be formed between the arbitrary adjacent etched cavities with a controllable size-reduction process. By arranging the cavities in a regular array, silicon walls with same width along three orientations can be fabricated synchronously. After the self-limiting oxidation, SiNWs are generated on the top center of each wall with 120° angle forming a honeycomb array.
Keywords :
elemental semiconductors; etching; microfabrication; nanofabrication; nanowires; silicon; (111) silicon wafer; Si; anisotropic wet-etching mechanism; low-cost top-down technology; microfabrication technology; monolayer silicon wafer; regular array; self-limiting oxidation; silicon nanowires honeycomb array fabrication; silicon walls; size-reduction process; Arrays; Cavity resonators; Fabrication; Nanowires; Silicon; Wet etching; Silicon nanowire; anisotropic; self-limiting;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), 2013 Transducers & Eurosensors XXVII: The 17th International Conference on
Conference_Location :
Barcelona
DOI :
10.1109/Transducers.2013.6626967