• DocumentCode
    3458150
  • Title

    Digital signal processing method for multilayered media thickness measurement

  • Author

    Delebarre, C. ; Bruneel, C. ; Miquet, P.

  • Author_Institution
    Lab. Opto-Acousto-Electron., CNRS, Valenciennes, France
  • fYear
    1988
  • fDate
    2-5 Oct 1988
  • Firstpage
    1027
  • Abstract
    An ultrasonic thickness measurement system for the 20- to 110-μm range has been developed for thin paint layers on metallic or nonmetallic substrates. In the case of a multilayered sample this system generally furnishes only the sum of the different thicknesses. Thus, a digital signal-processing method has been developed to extract the different values of thickness from the power spectral density. This method is based on a power cepstrum analysis, defined as the Fourier transform of the logarithm power spectral density of the radio-frequency signal. This technique gives, in the case of three layers, the three thicknesses and their linear combinations. Experimental results confirm the effectiveness of the proposed method
  • Keywords
    acoustic signal processing; thickness measurement; ultrasonic measurement; 20 to 110 micron; Fourier transform; acoustic signal processing; digital signal-processing; logarithm power spectral density; multilayered media thickness measurement; power cepstrum analysis; power spectral density; thin paint layers; ultrasonic; Delay; Digital signal processing; Fourier transforms; Frequency; Paints; Reflection; Scattering; Thickness measurement; Ultrasonic transducers; Ultrasonic variables measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 1988. Proceedings., IEEE 1988
  • Conference_Location
    Chicago, IL
  • Type

    conf

  • DOI
    10.1109/ULTSYM.1988.49533
  • Filename
    49533