DocumentCode
3458150
Title
Digital signal processing method for multilayered media thickness measurement
Author
Delebarre, C. ; Bruneel, C. ; Miquet, P.
Author_Institution
Lab. Opto-Acousto-Electron., CNRS, Valenciennes, France
fYear
1988
fDate
2-5 Oct 1988
Firstpage
1027
Abstract
An ultrasonic thickness measurement system for the 20- to 110-μm range has been developed for thin paint layers on metallic or nonmetallic substrates. In the case of a multilayered sample this system generally furnishes only the sum of the different thicknesses. Thus, a digital signal-processing method has been developed to extract the different values of thickness from the power spectral density. This method is based on a power cepstrum analysis, defined as the Fourier transform of the logarithm power spectral density of the radio-frequency signal. This technique gives, in the case of three layers, the three thicknesses and their linear combinations. Experimental results confirm the effectiveness of the proposed method
Keywords
acoustic signal processing; thickness measurement; ultrasonic measurement; 20 to 110 micron; Fourier transform; acoustic signal processing; digital signal-processing; logarithm power spectral density; multilayered media thickness measurement; power cepstrum analysis; power spectral density; thin paint layers; ultrasonic; Delay; Digital signal processing; Fourier transforms; Frequency; Paints; Reflection; Scattering; Thickness measurement; Ultrasonic transducers; Ultrasonic variables measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium, 1988. Proceedings., IEEE 1988
Conference_Location
Chicago, IL
Type
conf
DOI
10.1109/ULTSYM.1988.49533
Filename
49533
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