Title :
Frequency characteristics of ultrasonic wire bonding using high frequency vibration systems of 40 kHz to 780 kHz
Author :
Tsujino, Jiromaru ; Hasegawa, Koichi ; Sone, Yukio ; Nozaki, Koji
Author_Institution :
Fac. of Eng., Kanagawa Univ., Yokohama, Japan
Abstract :
Welding characteristics of ultrasonic wire bonding for IC or LSI using 40 kHz to 780 kHz linear vibration welding systems are studied to improve the welding characteristics. Welding specimens used are soft and hard aluminum wires 0.1 mm and 0.03 mm in diameter, and copper plates 1.0 mm in thickness as a lower specimens. Frequency characteristics of required welding tip vibration amplitude and velocity for sufficient welding of these specimens are measured. Temperature rises at welding surface are measured by thermo-electric-motive force between aluminum and copper specimens and the maximum temperature measured is about 300 degrees centigrade
Keywords :
lead bonding; ultrasonic welding; vibrations; 40 to 780 kHz; Al; Cu; IC; LSI; aluminum wire; copper plate; frequency characteristics; high frequency vibration system; temperature rise; thermo-electric-motive force; ultrasonic wire bonding; welding; Aluminum; Bonding; Copper; Force measurement; Frequency; Large scale integration; Temperature measurement; Vibration measurement; Welding; Wire;
Conference_Titel :
Ultrasonics Symposium, 1996. Proceedings., 1996 IEEE
Conference_Location :
San Antonio, TX
Print_ISBN :
0-7803-3615-1
DOI :
10.1109/ULTSYM.1996.584166
