DocumentCode
3458646
Title
Nanoflex for neural nanoprobes
Author
Ledochowitsch, Peter ; Tiefenauer, R.F. ; Pepin, B. ; Maharbiz, Michel M. ; Blanche, Timothy J.
Author_Institution
Univ. of California, Berkeley, Berkeley, CA, USA
fYear
2013
fDate
16-20 June 2013
Firstpage
1278
Lastpage
1281
Abstract
Scaling up the number of recording sites for neuronal interfaces while minimizing the impact on brain function presents several engineering challenges. Here we focus on miniaturizing the probe cable interconnects to minimize tethering forces at the probe-brain interface, allow multiple probes to be implanted in adjacent brain regions, and decrease damage associated with deep brain implants. We fabricated 32- and 64-channel Parylene C cables ranging in length from 7-65 mm for use with next-generation silicon probes (`nanoprobes´). To reduce cable width, 10 μm pitch leads were patterned on two layers sandwiched between three layers of parylene (overall thickness 15μm). The compliance of the cables was modeled using Timoshenko beam bending theory. Reliability was assessed using accelerated lifetime testing with electrochemical impedance monitoring. These `nanoflex´ cables are an order of magnitude smaller and two orders of magnitude more flexible than existing commercially available devices, a key technology for making viable long term, high-density neuronal recordings in both superficial and deep brain structures.
Keywords
biochemistry; biomedical equipment; brain; electrochemical impedance spectroscopy; nanofabrication; nanomedicine; neurophysiology; prosthetics; Timoshenko beam bending theory; brain function; deep brain implants; deep brain structures; electrochemical impedance monitoring; high-density neuronal recordings; nanoflex cable; neural nanoprobes; neuronal interfaces; next-generation silicon probes; parylene C cables; probe-brain interface; Annealing; Electrodes; Impedance; Metals; Probes; Silicon; Testing; flex cable; neural interface; parylene; polytrode;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), 2013 Transducers & Eurosensors XXVII: The 17th International Conference on
Conference_Location
Barcelona
Type
conf
DOI
10.1109/Transducers.2013.6627009
Filename
6627009
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