DocumentCode :
3458825
Title :
A Kind of Shock Resistance Method on Silicon Micro-Machined Gyroscope
Author :
Mao, Xu ; Ming, Liang ; Liu, Yu ; Zhang, Fuxue
Author_Institution :
Res. Centre of Sensors Electron. Inst., Beijing Inf. Technol. Inst., Beijing
fYear :
2006
fDate :
20-23 Aug. 2006
Firstpage :
101
Lastpage :
105
Abstract :
This paper reported a silicon micro-machined gyroscope that is driven by the rotating carrier\´s angular velocity; this gyroscope was manufactured by micro-electronic fabrication and bulk Si etching technology. Using electrode position restricting, resin packing, "sandwich" structure and latex flake, the shock resistance of gyroscope can reach 5000 g. The measured results showed that the gyroscope has good consistency and repetitiousness.
Keywords :
etching; gyroscopes; micromachining; angular velocity; bulk Si etching technology; electrode position restricting; latex flake; micro-electronic fabrication; resin packing; rotating carrier; sandwich structure; shock resistance method; silicon micromachined gyroscope; Angular velocity; Electric shock; Electrodes; Etching; Fabrication; Gyroscopes; Pulp manufacturing; Resins; Sandwich structures; Silicon; Micro-machined gyroscope; Shock resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Information Acquisition, 2006 IEEE International Conference on
Conference_Location :
Shandong
Print_ISBN :
1-4244-0528-9
Electronic_ISBN :
1-4244-0529-7
Type :
conf
DOI :
10.1109/ICIA.2006.305891
Filename :
4097824
Link To Document :
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