DocumentCode
3458825
Title
A Kind of Shock Resistance Method on Silicon Micro-Machined Gyroscope
Author
Mao, Xu ; Ming, Liang ; Liu, Yu ; Zhang, Fuxue
Author_Institution
Res. Centre of Sensors Electron. Inst., Beijing Inf. Technol. Inst., Beijing
fYear
2006
fDate
20-23 Aug. 2006
Firstpage
101
Lastpage
105
Abstract
This paper reported a silicon micro-machined gyroscope that is driven by the rotating carrier\´s angular velocity; this gyroscope was manufactured by micro-electronic fabrication and bulk Si etching technology. Using electrode position restricting, resin packing, "sandwich" structure and latex flake, the shock resistance of gyroscope can reach 5000 g. The measured results showed that the gyroscope has good consistency and repetitiousness.
Keywords
etching; gyroscopes; micromachining; angular velocity; bulk Si etching technology; electrode position restricting; latex flake; micro-electronic fabrication; resin packing; rotating carrier; sandwich structure; shock resistance method; silicon micromachined gyroscope; Angular velocity; Electric shock; Electrodes; Etching; Fabrication; Gyroscopes; Pulp manufacturing; Resins; Sandwich structures; Silicon; Micro-machined gyroscope; Shock resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Information Acquisition, 2006 IEEE International Conference on
Conference_Location
Shandong
Print_ISBN
1-4244-0528-9
Electronic_ISBN
1-4244-0529-7
Type
conf
DOI
10.1109/ICIA.2006.305891
Filename
4097824
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