Title :
Extraction Method for the Residual Stress in Multilayer Microplates Under Large Deflection Based on Static Deflection Analysis
Author :
Changizi, Amin ; Stiharu, Ion ; Olbrechts, Benoit ; Raskin, Jean-Pierre
Author_Institution :
Concordia Center for Adv. Vehicle Eng. Res. Centre, Concordia Univ., Montreal, QC, Canada
Abstract :
This investigation presents a method of extraction of the built-in stress in films grown by thin-film deposition or growing in microplate structures. Although thin-film deposition processes are well controlled, the stress values might significantly vary, reaching ±40% of the projected value. The assumption of variance yields more accurate solutions for the deflection than the values obtained by assuming the exact interlaminar stress yielded by the deposition process. The extraction method was used in conjunction with a gradient-based optimization method to evaluate the effective stress based on the response of the microplate to distributed load. The estimation of the deflection in the model versus the experimental method is based on static deflection matching. The estimation of root-mean-square error based on the proposed model was reduced to 0.38% versus the experimental evaluation, while the deflection resulting from the assumption of the nominal interlaminar stress yield errors of up to 40% versus experiments.
Keywords :
coating techniques; gradient methods; internal stresses; mean square error methods; multilayers; semiconductor thin films; built-in stress; distributed load; gradient-based optimization method; interlaminar stress; microplate structures; multilayer microplates; residual stress; root-mean-square error; static deflection analysis; static deflection matching; thin-film deposition processes; Equations; Finite element analysis; Mathematical model; Nonhomogeneous media; Residual stresses; Sensors; Finite element methods; Stone equation.; measurement errors; nonlinear differential equations; optimization methods; pressure measurement; stone equation;
Journal_Title :
Microelectromechanical Systems, Journal of
DOI :
10.1109/JMEMS.2015.2388532