Correlations between initial via resistance and reliability performance

Author

Graas, Carole D. ; Le, Huy A. ; Rosi, T.A.

Author_Institution

Logic Production Reliability, Texas Instrum. Inc., Dallas, TX, USA

fYear

1997

fDate

8-10 Apr 1997

Firstpage

44

Lastpage

48

Abstract

Accelerated stressing and electromigration (EM) testing were conducted on W-plug via chains and Van der Pauw structures respectively. These populations were chosen to include a wide distribution of initial resistances R₀. The high-end of the R₀ distribution exhibited a higher early failure rate and a higher spread in EM time-to-fail distribution. Processes which produce tightly controlled time-zero via resistance distributions are more desirable for via reliability

Keywords

electromigration; failure analysis; integrated circuit interconnections; integrated circuit metallisation; integrated circuit reliability; life testing; tungsten; TiN-AlCu-TiN; Van der Pauw structures; W; W-plug via chains; accelerated stressing; early failure rate; electromigration testing; initial resistance distribution; reliability performance; time-to-fail distribution; time-zero via resistance distributions; via reliability; wearout characterization; Chip scale packaging; Electromigration; Instruments; Lead; Life estimation; Logic; Metallization; Microstructure; Testing; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability Physics Symposium, 1997. 35th Annual Proceedings., IEEE International

Conference_Location

Denver, CO

Print_ISBN

0-7803-3575-9

Type

conf

DOI

10.1109/RELPHY.1997.584233

Filename

584233