DocumentCode :
3459988
Title :
Adapting to Intermittent Faults in Future Multicore Systems
Author :
Wells, Philip M. ; Chakraborty, Koushik ; Sohi, Gurindar S.
Author_Institution :
Univ. of Wisconsin, Madison
fYear :
2007
fDate :
15-19 Sept. 2007
Firstpage :
431
Lastpage :
431
Abstract :
As technology continues to scale, future multicore processors become more susceptible to a variety of hardware failures. In particular, intermittent faults, are expected to become especially problematic (S. Borkar et al., 2003), (C. Constantinescu, 2007). A circuit is susceptible to intermittent faults when manufacturing process variation or in-progress wear-out causes the parameters (e.g., resistance, threshold voltage, etc.) of devices within the circuit to vary beyond design expectations (C. Constantinescu, 2007). This susceptibility, combined with certain operating conditions, such as thermal hot-spots and voltage fluctuations, can result in timing errors - even if these temperatures and voltages, for example, are well within the specified "acceptable" margins. Unlike transient faults, which disappear quickly, or permanent faults, which persist indefinitely, the occurrence of intermittent faults is bursty in nature. Depending on the cause, these bursts of frequent faults can last from several cycles to several seconds or more, effectively rendering a core useless during this time.
Keywords :
microprocessor chips; semiconductor device reliability; hardware failures; intermittent faults; multicore processors; thermal hot-spots; voltage fluctuations; Circuit faults; Concurrent computing; Fault detection; Hardware; Manufacturing processes; Multicore processing; Parallel architectures; Threshold voltage; Voltage fluctuations; Yarn;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Parallel Architecture and Compilation Techniques, 2007. PACT 2007. 16th International Conference on
Conference_Location :
Brasov
ISSN :
1089-795X
Print_ISBN :
978-0-7695-2944-8
Type :
conf
DOI :
10.1109/PACT.2007.4336259
Filename :
4336259
Link To Document :
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