Title :
Power module technology for home power electronics
Author :
Majumdar, Gourab
Author_Institution :
Power Device Works, Mitsubishi Electr. Corp., Fukuoka, Japan
Abstract :
A review of power module technologies used for inverter based home appliances have been made in this paper detailing elaborately about de facto Dual-In-line Intelligent Power Module (DIPIPM) and PV-IPM device groups. Descriptions of key technologies used in the growth process of these device families are also given highlighting on the latest trends in IGBT power chip, HVIC and packaging structure.
Keywords :
domestic appliances; insulated gate bipolar transistors; power integrated circuits; DIPIPM; HVIC; IGBT power chip; PV-IPM device; dual-in-line intelligent power module; home power electronics; inverter-based home appliances; packaging structure; power module technology; Cities and towns; Electronics packaging; Epoxy resins; Home appliances; Insulated gate bipolar transistors; Inverters; Multichip modules; Power electronics; Power engineering and energy; Power system reliability; DIPIPM; HVIC; IGBT and PV-IPM;
Conference_Titel :
Power Electronics Conference (IPEC), 2010 International
Conference_Location :
Sapporo
Print_ISBN :
978-1-4244-5394-8
DOI :
10.1109/IPEC.2010.5543291
