DocumentCode
3460006
Title
Power module technology for home power electronics
Author
Majumdar, Gourab
Author_Institution
Power Device Works, Mitsubishi Electr. Corp., Fukuoka, Japan
fYear
2010
fDate
21-24 June 2010
Firstpage
773
Lastpage
777
Abstract
A review of power module technologies used for inverter based home appliances have been made in this paper detailing elaborately about de facto Dual-In-line Intelligent Power Module (DIPIPM) and PV-IPM device groups. Descriptions of key technologies used in the growth process of these device families are also given highlighting on the latest trends in IGBT power chip, HVIC and packaging structure.
Keywords
domestic appliances; insulated gate bipolar transistors; power integrated circuits; DIPIPM; HVIC; IGBT power chip; PV-IPM device; dual-in-line intelligent power module; home power electronics; inverter-based home appliances; packaging structure; power module technology; Cities and towns; Electronics packaging; Epoxy resins; Home appliances; Insulated gate bipolar transistors; Inverters; Multichip modules; Power electronics; Power engineering and energy; Power system reliability; DIPIPM; HVIC; IGBT and PV-IPM;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Electronics Conference (IPEC), 2010 International
Conference_Location
Sapporo
Print_ISBN
978-1-4244-5394-8
Type
conf
DOI
10.1109/IPEC.2010.5543291
Filename
5543291
Link To Document