Automatic process design for 3D thick-film grayscale photolithography

Author

van Kempen, F.C.M. ; Hirai, Yuki ; van Keulen, Fred ; Tabata, Osamu

Author_Institution

Precision & Microsyst. Eng., Tech. Univ. Delft, Delft, Netherlands

fYear

2013

fDate

16-20 June 2013

Firstpage

1625

Lastpage

1628

Abstract

A novel process optimization tool for grayscale lithography is developed and demonstrated to fabricate three-dimensional (3D) microstructures using thick-film photoresists. For the first time, the two process parameters in grayscale lithography: exposure dose profile and development time are determined automatically for a user-specified target 3D profile. This provides an inexpensive and effective alternative to conventional trial-and-error based process design. The optimized parameters were verified by fabricating various 3D microstructures and the experiments revealed good quantitative agreement with the target profile.

Keywords

photoresists; process design; three-dimensional integrated circuits; 3D thick-film grayscale photolithography; automatic process design; development time; exposure dose profile; thick-film photoresists; three-dimensional microstructures; user-specified target 3D profile; Gray-scale; Lithography; Optimization methods; Resists; Surface treatment; Three-dimensional displays; 3D Microstructuring; Automatic Process Design; Design Optimization; Grayscale Photolithography;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), 2013 Transducers & Eurosensors XXVII: The 17th International Conference on

Conference_Location

Barcelona

Type

conf

DOI

10.1109/Transducers.2013.6627095

Filename

6627095