Wafer-level-package for Bulk Acoustic Wave (BAW) filters

Author

Franosch, M. ; Oppermann, K.-G. ; Meckes, A. ; Nessler, W. ; Aigner, R.

Author_Institution

Infineon Technol. AG, Munich, Germany

Volume

2

fYear

2004

fDate

6-11 June 2004

Firstpage

493

Abstract

Silicon based Bulk-Acoustic-Wave (BAW) filters utilize mainstream wafer processing and can create significant customer benefit in terms of cost, performance and size. Similar to conventional SAW filters the package is a dominant cost contributor as long as ceramic cavity packages are used. For both SAW and BAW the active area may not be coated with any package material. We report on an innovative process which enables to manufacture BAW filters in cheap plastic SMD packages similar to packages in use for diodes and transistors. Our process is based photo-epoxy SU-8 which allows to build air-cavities above the active areas of a filter. The process is cheap as it is done on wafer level and fits well into a CMOS manufacturing environment.

Keywords

bulk acoustic wave devices; elemental semiconductors; plastic packaging; polymers; silicon; surface acoustic wave filters; surface mount technology; BAW; CMOS manufacturing environment; SAW filters; SMD packages; Si; air cavities; bulk acoustic wave filters; ceramic cavity packages; diodes; photoepoxy SU-8; silicon; surface acoustic wave filters; surface mount device package; system in package; transistors; wafer level package; wafer processing; Acoustic waves; Ceramics; Costs; Diodes; Manufacturing processes; Plastic packaging; SAW filters; Silicon; Surface acoustic waves; Wafer scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 2004 IEEE MTT-S International

ISSN

0149-645X

Print_ISBN

0-7803-8331-1

Type

conf

DOI

10.1109/MWSYM.2004.1336020

Filename

1336020