On-chip ovenization of encapsulated Disk Resonator Gyroscope (drg)

Author

Ahn, C.H. ; Hong, V.A. ; Park, W. ; Yang, Y. ; Chen, Y. ; Ng, E.J. ; Huynh, J. ; Challoner, A.D. ; Goodson, K.E. ; Kenny, T.W.

Author_Institution

Dept. of Mech. Eng., Stanford Univ., Stanford, CA, USA

fYear

2015

fDate

21-25 June 2015

Firstpage

39

Lastpage

42

Abstract

This paper reports, for the first time, a single-chip ovenization of a fully-encapsulated MEMS gyroscope to improve the stability of the scale factor and bias. We use the frequency output of the gyroscope as a thermometer, and, in turn heat the device through an on-chip silicon heater defined in the encapsulation layer. During temperature-controlled operation, the scale factor holds constant and the bias remains less than 1°/s, even as external temperature changed from 0-80°C.

Keywords

elemental semiconductors; encapsulation; gyroscopes; microfabrication; micromechanical resonators; microsensors; silicon; stability; temperature sensors; thermometers; DRG; Si; encapsulated disk resonator gyroscope; fully-encapsulated MEMS gyroscope; on-chip ovenization; on-chip silicon heater; scale factor; single-chip ovenization; stability; temperature 0 degC to 80 degC; temperature controlled operation; thermometer; Encapsulation; Gyroscopes; Heating; Micromechanical devices; Temperature; Temperature measurement; Temperature sensors; μ-Oven; Disk resonator gyroscope (DRG); bias drift; epi-seal; scale factor drift; temperature compensation;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2015 Transducers - 2015 18th International Conference on

Conference_Location

Anchorage, AK

Type

conf

DOI

10.1109/TRANSDUCERS.2015.7180855

Filename

7180855