Title :
MEMS-IC integration for RF and millimeterwave applications
Author :
Dubuc, D. ; De Raedt, W. ; Carchon, G. ; Do, M.N. ; Fourn, E. ; Grenier, K. ; Plana, R.
Author_Institution :
LAAS-CNRS, Toulouse, France
Abstract :
This paper reports on the MEMS-IC integration for microwave and millimeterwave applications. The integration is based on the system in package (SiP) approach achieving high performances and integration density level at microwave and millimeterwave frequencies thanks to the mixing of state-of-the-art technologies both for active (SiGe or RF-MOS technologies) and passive (dielectric based technology) devices/circuits. This concept can also take full benefit of the MEMS technologies to provide various smart functionalities to microsystem. The proposed approach is illustrated through different applications which outline the design issues of such heterogeneous microsystem.
Keywords :
micromechanical devices; microwave integrated circuits; millimetre wave integrated circuits; system-in-package; MEMS-IC integration; RF-MOS; active devices; dielectric based technology; heterogeneous microsystem; microwave application; millimeter wave application; passive devices; system in package; Germanium silicon alloys; Integrated circuit technology; MIM capacitors; Micromechanical devices; Microwave devices; Microwave technology; Packaging; Radio frequency; Resonant frequency; Silicon germanium;
Conference_Titel :
Microwave Conference, 2005 European
Print_ISBN :
2-9600551-2-8
DOI :
10.1109/EUMC.2005.1610229
