• DocumentCode
    3460578
  • Title

    Broadband CMOS class-E power amplifier for LTE applications

  • Author

    Kalim, Danish ; Erguvan, Denis ; Negra, Renato

  • Author_Institution
    UMIC Res. Centre, RWTH Aachen Univ., Aachen, Germany
  • fYear
    2009
  • fDate
    6-8 Nov. 2009
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    High level integration for system on chip (SOC) applications motivates the development of broadband power amplifiers (PAs) in low cost CMOS technology to reduce size and power consumption of any wireless system. However, integration of one of the key components in a transmitter-the PA still remains a challenge. In this paper, a single stage broadband class-E PA based on lumped element load transformation network (LTN) in 90 nm CMOS technology for LTE band i.e. 2.67 GHz is presented. The simulations with a 2.5 V supply voltage show that the designed PA can deliver an output power (Pout) of 22.9 dBm with an associated power gain (G) of 8.9 dB and power added efficiency (PAE) of 60.4 %. A PAE of more than 55 %, output power of 21.5 dBm and a gain of more than 7.5 dB was achieved over a wide bandwidth i.e. from 2.3 GHz to 3.3 GHz. The frequency range also covers wireless local area network (WLAN) and bluetooth applications.
  • Keywords
    CMOS integrated circuits; MMIC power amplifiers; UHF integrated circuits; UHF power amplifiers; field effect MMIC; low-power electronics; lumped parameter networks; wideband amplifiers; CMOS technology; SOC; WLAN application; bandwidth 2.3 GHz to 3.3 GHz; bluetooth; broadband CMOS class-E power amplifier; broadband class-E PA; gain 8.9 dB; lumped element load transformation network; power added efficiency; single stage class-E PA; size 90 nm; system on chip; voltage 2.5 V; wireless local area network; Broadband amplifiers; CMOS technology; Costs; Energy consumption; High power amplifiers; Power amplifiers; Power generation; System-on-a-chip; Voltage; Wireless LAN; Broadband power amplifiers (PAs); CMOS technology; class-E; load transformation networks (LTNs); switching-mode power amplifiers (SMPAs); system on chip (SOC);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Signals, Circuits and Systems (SCS), 2009 3rd International Conference on
  • Conference_Location
    Medenine
  • Print_ISBN
    978-1-4244-4397-0
  • Electronic_ISBN
    978-1-4244-4398-7
  • Type

    conf

  • DOI
    10.1109/ICSCS.2009.5412567
  • Filename
    5412567