Title :
Wide-band aero-acoustic microphone with improved low-frequency characteristics
Author :
Zhou, Z.J. ; Rufer, Libor ; Salze, E. ; Ollivier, S. ; Wong, Man
Author_Institution :
Hong Kong Univ. of Sci. & Technol., Hong Kong, China
Abstract :
A wide-band aero-acoustic microphone was realized using a bulk micro-machining process based on the deep reactive-ion etching of silicon. Compared to the previously reported surface micromachined microphone, the sensing diaphragm is completely sealed, thus eliminating the loss of low-frequency response associated with the release holes. A dynamic sensitivity of ~0.33 μV/V/Pa was measured using optically calibrated acoustic shockwaves (“N-wave”) generated using a high-voltage electrical spark-discharge system. This value is comparable to the ~0.28 μV/V/Pa static sensitivity, measured using a nano-indentation technique. The response of the microphone is relatively flat from 6 kHz to 500kHz, with a resonant frequency of ~715 kHz.
Keywords :
aeroacoustics; elemental semiconductors; micromachining; microphones; shock waves; silicon; sputter etching; N-wave; Si; bulk micromachining process; deep reactive-ion etching; dynamic sensitivity; frequency 6 kHz to 500 kHz; high-voltage electrical spark-discharge system; low-frequency characteristics; nanoindentation technique; optically calibrated acoustic shockwaves; silicon; wide-band aero-acoustic microphone; Acoustics; Microphones; Optical variables measurement; Semiconductor device measurement; Sensitivity; Sensors; Silicon; Aero-acoustic; Bulk micro-machining; DRIE; MEMS; MILC; Wide-band;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), 2013 Transducers & Eurosensors XXVII: The 17th International Conference on
Conference_Location :
Barcelona
DOI :
10.1109/Transducers.2013.6627147