Title :
Ultrasonic properties of oriented ceramic high Tc superconductors
Author :
Levy, Moises ; Xu, M.F. ; Sarma, Bimal K. ; Zhao, Z. ; Adenwalla, S. ; Robinson, Q. ; Ketterson, J.B.
Author_Institution :
Dept. of Phys., Wisconsin Univ., Milwaukee, WI, USA
Abstract :
The results of both attenuation and velocity measurements on sinter-forged polycrystalline YBa2Cu3O7-δ samples are discussed. Optical micrographic and X-ray diffraction measurements indicate that these sinter-forged samples have more than 80% of the crystallites aligned with the c-axis parallel to the forging axis. Attenuation measurements of longitudinal waves perpendicular to the forging axis exhibit three relative maxima as a function of temperature at 70 K, 180 K, and 250 K, whereas longitudinal waves parallel to the forging axis only exhibit one relative maximum at 180 K. These measurements imply that the high- and low-temperature maxima are associated with disturbances in Cu-O planes of these high Tc superconductors, and therefore analysis of these maxima may yield information about interaction in these planes. The velocity data show lattice softening at temperatures much higher than Tc as the sample is cooled. This softening is arrested below Tc. A strong hysteresis is observed in the temperature dependence of these velocity curves
Keywords :
attenuation measurement; barium compounds; high-temperature superconductors; ultrasonic absorption; ultrasonic velocity measurement; yttrium compounds; 180 K; 250 K; 70 K; X-ray diffraction measurements; YBa2Cu3O7; attenuation measurements; ceramic high temperature superconductors; forging axis; high Tc superconductors; hysteresis; lattice softening; longitudinal waves; optical micrograph; sinter-forged samples; ultrasonic properties; velocity measurements; Attenuation measurement; Ceramics; Crystallization; Optical attenuators; Optical diffraction; Softening; Temperature; Ultrasonic variables measurement; Velocity measurement; X-ray diffraction;
Conference_Titel :
Ultrasonics Symposium, 1988. Proceedings., IEEE 1988
Conference_Location :
Chicago, IL
DOI :
10.1109/ULTSYM.1988.49548