Title :
Design of a high speed digital interface for multi-standard mobile transceiver RFICs in 0.13 μm CMOS
Author :
Chabrak, K. ; Bachmann, F. ; Hueber, G. ; Seemann, K. ; Maurer, L. ; Boos, Z. ; Weigel, R.
Author_Institution :
Inst. for Electron. Eng., Erlangen Univ., Germany
Abstract :
This paper presents the design of two different digital interfaces, both based on current signalling. First the requirements for a digital interface at the baseband output of a multi-standard mobile phone RF front-end are explained. The paper gives an insight of the popular digital interfaces and presents a new concept which is more robust against the ground bounce effect. At the end measurement results of a realized test chip are shown.
Keywords :
CMOS integrated circuits; mobile handsets; radiofrequency integrated circuits; transceivers; CMOS technology; ground bounce effect; high speed digital interface; multistandard mobile phone RF front-end; multistandard mobile transceiver; transceiver RFIC; Baseband; CMOS digital integrated circuits; CMOS technology; Capacitance; Crosstalk; RF signals; Radio frequency; Transceivers; Voltage; Wires;
Conference_Titel :
Microwave Conference, 2005 European
Print_ISBN :
2-9600551-2-8
DOI :
10.1109/EUMC.2005.1610279
