• DocumentCode
    3461634
  • Title

    Reducing instability and enhancing critical heat flux using integrated micropillars in two-phase microchannel heat sinks

  • Author

    Zhu, Y. ; Antao, D.S. ; Bian, D.W. ; Zhang, T.J. ; Wang, E.N.

  • Author_Institution
    Dept. of Mech. Eng., M.I.T., Cambridge, MA, USA
  • fYear
    2015
  • fDate
    21-25 June 2015
  • Firstpage
    343
  • Lastpage
    346
  • Abstract
    We present a novel design of two-phase microchannel heat sink with integrated micropillars on the bottom heated surface. The microchannel can achieve significantly reduced flow boiling instability, and an enhanced heat transfer coefficient (40%) and critical heat flux (17%) compared to that without micropillars. In this design, the liquid film on the heated surface is sustained due to the capillary force within the micropillars and thin film evaporation dominates the heat transfer. The experimental results indicate that the capillary pressure can be maximized without introducing large viscous drag when the microstructure geometry is optimized. The insights gained from this work guide the design of stable, high performance two-phase microchannel heat sinks.
  • Keywords
    electronics packaging; heat sinks; microchannel flow; bottom heated surface; critical heat flux enhancement; instability reduction; integrated micropillars; liquid film; two-phase microchannel heat sinks; Fluid flow; Heat sinks; Resistance; Resistance heating; Silicon; Thermal stability; Thermal management; critical heat flux; flow instability; microstructured surface; packaging; two-phase flow;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2015 Transducers - 2015 18th International Conference on
  • Conference_Location
    Anchorage, AK
  • Type

    conf

  • DOI
    10.1109/TRANSDUCERS.2015.7180931
  • Filename
    7180931