DocumentCode :
3461634
Title :
Reducing instability and enhancing critical heat flux using integrated micropillars in two-phase microchannel heat sinks
Author :
Zhu, Y. ; Antao, D.S. ; Bian, D.W. ; Zhang, T.J. ; Wang, E.N.
Author_Institution :
Dept. of Mech. Eng., M.I.T., Cambridge, MA, USA
fYear :
2015
fDate :
21-25 June 2015
Firstpage :
343
Lastpage :
346
Abstract :
We present a novel design of two-phase microchannel heat sink with integrated micropillars on the bottom heated surface. The microchannel can achieve significantly reduced flow boiling instability, and an enhanced heat transfer coefficient (40%) and critical heat flux (17%) compared to that without micropillars. In this design, the liquid film on the heated surface is sustained due to the capillary force within the micropillars and thin film evaporation dominates the heat transfer. The experimental results indicate that the capillary pressure can be maximized without introducing large viscous drag when the microstructure geometry is optimized. The insights gained from this work guide the design of stable, high performance two-phase microchannel heat sinks.
Keywords :
electronics packaging; heat sinks; microchannel flow; bottom heated surface; critical heat flux enhancement; instability reduction; integrated micropillars; liquid film; two-phase microchannel heat sinks; Fluid flow; Heat sinks; Resistance; Resistance heating; Silicon; Thermal stability; Thermal management; critical heat flux; flow instability; microstructured surface; packaging; two-phase flow;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2015 Transducers - 2015 18th International Conference on
Conference_Location :
Anchorage, AK
Type :
conf
DOI :
10.1109/TRANSDUCERS.2015.7180931
Filename :
7180931
Link To Document :
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