DocumentCode
3462215
Title
White light interferometry for 3D inspection
Author
Schaulin, M.
Author_Institution
Electronics Packaging Laboratory, Dresden University of Technology, 01062 Dresden, Germany
fYear
2004
fDate
8-10 Sept. 2004
Firstpage
41
Lastpage
45
Abstract
For inspection of advanced packages in the assembling process of electronics manufacturing precise and fast 3D measurement methods desired. White light interferomety is a measuring method to acquire the shape of 3D surfaces very accurately. Aspects of the realization and the practical use of this measuring method are discussed. Parameters of the interferometer have been aligned at a electronic package.
Keywords
Assembly; Electronics packaging; Inspection; Interference; Manufacturing processes; Mirrors; Optical interferometry; Optical scattering; Optical sensors; Shape measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Photonics and Microsystems, 2004. Proceedings of 2004 International Students and Young Scientists workshop
Conference_Location
Acapulco, Mexico
Print_ISBN
0-7803-8598-5
Type
conf
DOI
10.1109/STYSW.2004.1459937
Filename
1459937
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