DocumentCode
3462547
Title
Investigation of nanowire orientation and embedded Si1-xGex source/drain influence on Twin Silicon Nano-Wire Field Effect Transistor (TSNWFET)
Author
Li, Ming ; Suk, Sung Dae ; Yeo, Kyoung Hwan ; Yeoh, Yun-young ; Cho, KeunHwi ; Kim, Dong-Won ; Park, Donggun
Author_Institution
R&D Center, Samsung Electron. Co., Kyungki-Do
fYear
2006
fDate
Oct. 2006
Firstpage
78
Lastpage
80
Abstract
This paper describes TSNWFET devices with embedded Si1-xGex source/drain regions and different nanowire orientations. Thick Si1-xGex embedded source/drain and lang110rang channel orientation is found effective to enhance p-channel TSNWFET performance, while cause degradation for n-channel one. Thin Si1-xGex and lang100rang channel orientation is the preferred combination for keeping n-TSNWFET performance. With lang110rang channel orientation and thick Si1-xGex in source/drain, p-MOS current, for the first time, is even observed to exceed its n-type counterpart from the experiments
Keywords
field effect transistors; nanowires; semiconductor device manufacture; silicon; Si; embedded source/drain regions; nanowire orientation investigation; p-MOS current; twin silicon nanowire field effect transistor devices; Compressive stress; Degradation; FETs; Fabrication; MOS devices; Nanoscale devices; Research and development; Silicon; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology, 2006. ICSICT '06. 8th International Conference on
Conference_Location
Shanghai
Print_ISBN
1-4244-0160-7
Electronic_ISBN
1-4244-0161-5
Type
conf
DOI
10.1109/ICSICT.2006.306082
Filename
4098026
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